https://www.offgridenergyindependence.com/tag/241/die-attach IDTechEx provides independent analysis on the development and application of RFID, Printed Electronics, Photovoltaics and Energy Harvesting en Copyright (C) IDTechEx Ltd With the trend from Si IGBT to SiC MOSFET in electric vehicle (EV) power electronics, the junction temperature is expected to increase from 150°C to 175°C with the potential to exceed 200°C. This brings significant challenges for thermal management.https://www.idtechex.com/en/research-article/the-rise-of-ag-sintering-and-cu-sintering/31286?rsst2id=241https://www.idtechex.com/en/research-article/the-rise-of-ag-sintering-and-cu-sintering/31286?rsst2id=241Fri, 21 Jun 2024 ZZZy.wang@idtechex.com (Yulin Wang)