Webinar: Thermal Interface Materials: TIM1, TIM1.5, TIM2 - 3.2x market size increase from 2025 to 2036
Presenter: Yulin Wang, Senior Technology Analyst, IDTechEx
Date: Thursday 2nd October 2025
Join IDTechEx Senior Technology Analyst Yulin Wang for this insightful webinar, which will dive deep into the evolving world of TIMs, exploring how these materials are shaping the future of thermal management across diverse applications.
Choose your preferred time zone - the webinar runs three times during the day.
Can't attend live? Register anyway to receive the on-demand recording and presentation slides, available for a limited time.
From innovations in TIM conductivity, property trends, and TIM fillers to the latest developments in TIM1, TIM1.5, and TIM2 for various industries, attendees will gain insights into both the technical advancements and the market opportunities driving this field forward.
Attendees can expect key insights including:
• A complete overview of thermal interface materials by TIM form (TIM1, TIM1.5, TIM2)
• TIMs in EV battery packs and power electronics: evolving conductivity and performance requirements, TIM1 (die-attach), TIM1.5, and TIM2 advancements
• TIMs in data centers and advanced semiconductor packaging: new opportunities as cooling transitions toward liquid-based solutions
• TIMs in space and satellite
• TIMs in 5G
• TIMs in ADAS and next-gen automotive electronics
• TIMs in consumer electronics and high-density packaging